LMPT LBBP

Design Analysis Huawei Technologies FDD LTE Baseband Unit (BBU)

This report covers the design analysis of a Huawei Technologies FDD LTE. This unit is part of the DBS3900 system. The unit was manufactured between Q3-Q4 of 2011.

Key Findings:

• Modular chassis allows for single mode and multi-mode operation
• LBBPc card allows for capacity up to 2T2R 3 x 20MHz or 4T4R 3 x 10MHz

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Fairchild Semiconductor, HiSilicon Technologies, Integrated Device Technology, Maxim Integrated Products, Micrel, NXP Semiconductors, ON Semiconductor, STMicroelectronics, Texas Instruments, and Vishay Semiconductors.
 LTE CONFIGURATION 

LMPT
LBBP

Table 1: BSBC PCB Bill of Materials, Top
Table 2: BSBC PCB Bill of Materials, Bottom
Table 3: Fan Unit Bill of Materials
Table 4: Fan Unit PCB, Top Bill of Materials
Table 5: Fan Unit PCB, Bottom Bill of Materials
Table 6: UPEU Ethernet PCB Bill of Materials
Table 7: UPEU Main PCB Area A Bill of Materials
Table 8: UPEU Main PCB Area B Bill of Materials
Table 9: LMPT Top View Bill of Materials
Table 10: LMPT Top View Area A Bill of Materials
Table 11: LMPT Top View Area B Bill of Materials
Table 12: LMPT Bottom View Area B Bill of Materials
Table 13: LMPT Top View Area C Bill of Materials
Table 14: LMPT Bottom View Area C Bill of Materials
Table 15: LMPT Bottom View Bill of Materials
Table 16: LBBP Variant Specifications
Table 17: LBBP Variant Maximum Data Rate Support
Table 18: LBBP Top View Bill of Materials
Table 19: LBBP Bottom View Bill of Materials
Table 20: Passive Component Case Size Distribution by System Subsection
Table 21: Identified Passive Component Supplier Distribution by System Subsection
Table 22: Active/Passive Component Distribution by System Subsection
Table 23: Active Semiconductor/Component Vendor Distribution by System Subsection